Ben Makhlouf Email and Phone Number
Thermal Lead Engineer
at
Cooling Source, Inc.
Ben Makhlouf's email is ben.bmakh@gmail.com
.
Ben Makhlouf Contact Details
Email
ben.bmakh@gmail.com
Email
benbmakh@gmail.com
Email
bmakhlouf@nuventix.com
Email
bmakhlouf@coolingsource.com
Ben Makhlouf Company Details
Location
Livermore, California, United States
Industry
Electrical/Electronic Manufacturing
Ben Makhlouf's Experience and Education
Work Experience
Thermal Applications Engineer And Sales
2003-03 to 2011-05
Taylor, Texas, United States
Senior Thermal Design Engineer
2016-02 to 2017-10
Hayward, California, United States
Slan Thermal Solution Co. Ltd
Thermal Engineer Consultant And Sales
2014-12 to 2016-01
Shanghai, Shanghai, China
Led Thermal Mechanical Engineer
2013-12 to 2014-08
Nashville, Tennessee, United States
Thermo Cool Corporation
Thermal Applications Engineer And Sales
2013-02 to 2013-12
Education
International Business
1999 to 2000
Berkeley, California, United States
School Of Science Pierre & Marie Curie, Paris 6
Bachelor Of Science in Mechanical Engineering
Frequently Asked Questions about Ben Makhlouf
What company does Ben Makhlouf work for?
Ben Makhlouf works for Cooling Source, Inc.
What is Ben Makhlouf's role in his workplace?
Ben Makhlouf's role in his workplace is
Thermal Lead Engineer .
Which industry does Ben Makhlouf work in currently?
Ben Makhlouf works in the industry
Electrical/Electronic Manufacturing.
What is Ben Makhlouf's email address?
Ben Makhlouf's email address is ben.bmakh@gmail.com
What schools did Ben Makhlouf attended?
Ben Makhlouf attended
University Of California, Berkeley,
and
School Of Science Pierre & Marie Curie, Paris 6.
What are some of Ben Makhlouf's interests?
Ben Makhlouf has interests in
Children,
Education,
Environment,
Science And Technology,
and
Health.
What are some of Ben Makhlouf's skills?
Ben Makhlouf has skills like
Cfd,
Heat Transfer,
Electronics,
Thermal,
Simulations,
Solar Energy,
Testing,
Thermal Management,
Finite Element Analysis,
Solidworks,
Aerospace,
R&D,
Cooling,
Thermodynamics,
Heat,
Thermal Design,
Thermal Analysis,
Electronics Packaging,
Thermal Engineering,
Fluid Dynamics,
and
Simulation.
